Demand: Comprehensive Solutions
Budget: Cost Effective Quotation
Lead Time: Saving-time Supply Plan
Craft: Sample Wafer Deliver for Approval
Quality: Pre-inspection before Shipping
Tracking Progress: Report Routinely
Installation: According to your layout space
Debugging: Trail run to mass production capacity
Your Verification:Formal Operation
Zenith electroless plating machine are compatible to various diameters of wafer, including 8 inch and 12 inch wafers, offering stable output capacity that reach 7000+ pcs a month.
Horizontal electroplaWafer chemical coating equipment is a specialized device that deposits metal or alloy coatings on the surface of wafers through chemical reactions, achieving uniform and dense film coverage without the need for external current.ting equipment mainly used in high density interconnect, front copper interconnect, and substrate level packaging, with the advantage of high uniformity plating.
Forming a protective layer, conductive layer, or solder layer through redox reactions, such as ENIG and chemical nickel palladium gold (ENEPIG), etc
RDL, Bumping and TSV, Chemical copper plating is used to form interconnect structures and solve electrical connection problems in high-density packaging
For barrier layer, seed layer and protective later, plating prevents failure caused by metal migration, forming a thin film that is resistant to oxidation and corrosion.
Power Devices, RF Chips, Sensors & Optoelectronic Devices.
Chemical plating testing equipment is used for small batch wafer running of processing craft. With this type of testing equipment, you can verify processes and new designs with low cost and preciously control.
Zenith offer comprehensive solution for chemical plating equipment and chemical solution processes. The feeding & dosing quantity can be controlled by automatic, semi-auto, and manual method.
Wafer Foup Cases, Wafer Feeding Machine, Deliver Robot, Tank Materials, Heaters, Dryers, Analysis System, Dosing Control
Accurately control the thickness (nanometer to micrometer level), uniformity, and composition of the film layer.
3/ 0.3/ 0.03~0.05um
Ni>180nm/min,Pd>30nm/min,Au>4nm/min
70~80%, Wafer B Side: 100%
Support coating various materials such as oxides, nitrides, metals, etc., to meet complex process requirements.
Ni/ Pd / Au/ Al/ Copper
With the following one stop services for your electroless plating machines order, you can achieve a hussle-free experience from maintanence to comsumable materials.
Within warranty period, Replacing Parts are Provided for Free. After warranty period, parts for replacement can be provided at cost price. Lifetime services are offered.
Accept samples from customers to test electroplating craft by small batches. You can verify our machine performance by the samples. We cooperate with colleages, testing data can be provided.
We accept order industrial electroplating barrel machine with private labels. Zenith offer original craft design. Custom automatic wafer sorter machines are also available.
For Wafer
Etching Solution
For Advanced Packaging
Acid Solution
For Display Process
Alkali solution
Auxiliary Reagent
Chemical Pating Solution
Zenith photoresist, electroplating liquor and auxiliary reagent passed industry standard of benchmarking companies, which help offering you trustworthy one-stop services.
Yes, the cooperation support will not end after waranty period. But the price of component for replacement should be at cost price, while in waranty period this price is free. In addition, if you offer a new order of equipment, the price could be communicated.
Yes. We provide on-site set up services. Install, commissioning, calibration and debugging services are offered by our engineers. You can send us your lead time demands and we offer you ideal solusions.
Yes, we could provide private label or white label services. Customization services are available according to your demands.
Our electroless plating equipment systems have XM-NIAS, Ancosys(Pd/Au) and Ancosys(Pretreatment) for analyzing.
Other than chemical plating machines, we also provide electroplating equipment, wet benches( Wafer cleaning machines, chemical distribution system, foup cleaning machines) in manual, semi-auto and automation types, spin rinse dryer, marangoni dryer and semiconductor chiller equipment and related comsumbles.
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