Wafer Electroless Plating Equipment

Zenith, an industrial electroless plating machine manufafcturer in China, focusing on semiconductor and wafer processing equipment industry.

Easy Cooperation Steps

Communication

Demand: Comprehensive Solutions

Budget: Cost Effective Quotation

Lead Time: Saving-time Supply Plan

Free Consultant
Custom Solutions
Order Confirm

Production

Craft: Sample Wafer Deliver for Approval

Quality: Pre-inspection before Shipping

Tracking Progress: Report Routinely

100% Inspection
Welcome to Visit Workshop

On-site Set Up

Installation: According to your layout space

Debugging: Trail run to mass production capacity

Your Verification:Formal Operation

After-sale Support
Trial Production
Maintanance

Wafer Chemical Plating Equipment

Zenith electroless plating machine are compatible to various diameters of wafer, including 8 inch and 12 inch wafers, offering stable output capacity that reach 7000+ pcs a month.

Horizontal electroplaWafer chemical coating equipment is a specialized device that deposits metal or alloy coatings on the surface of wafers through chemical reactions, achieving uniform and dense film coverage without the need for external current.ting equipment mainly used in high density interconnect, front copper interconnect, and substrate level packaging, with the advantage of high uniformity plating.

  • High Efficiency: UP time≥95%, MTTR≤4hours, MTBF≥250hours
  • Compatible Wafer Diameter: 8 inch, 12 inch
  • Breakage rate: Less than 10 parts per million (PPM)
  • Warped Wafer: can be handled under automatic model (Warpage≤5mm)
  • WIW/WTW/RTR/Thickness Uniformity: Ni<10% Pd<10% Au<15%

Core Functions of Wafer Electroless Plating Machine

Film Deposition

Forming a protective layer, conductive layer, or solder layer through redox reactions, such as ENIG and chemical nickel palladium gold (ENEPIG), etc

Advanced Packaging

RDL, Bumping and TSV, Chemical copper plating is used to form interconnect structures and solve electrical connection problems in high-density packaging

Front-End Manufacturing

For barrier layer, seed layer and protective later, plating prevents failure caused by metal migration, forming a thin film that is resistant to oxidation and corrosion.

Special Devices Manufacturing

Power Devices, RF Chips, Sensors & Optoelectronic Devices.

Chemical Plating Testing Equipment

Chemical plating testing equipment is used for small batch wafer running of processing craft. With this type of testing equipment, you can verify processes and new designs with low cost and preciously control.

  • Single-Cavity: For craft verifications
  • Sampling Testing: We allow wafer samples from clients to test our craft by small batch, testing data can be availble as we have complete testing tools
  • Testing Data: Metal Thickness Gauge, SEM, Chemical Autolab, etc
  • Laboratory Consumbles: Chemical Solutions, Photoresist & Auxiliary Reagent, etc

Competitiveness of Zenith Electroless Plating Equipment

Zenith offer comprehensive solution for chemical plating equipment and chemical solution processes. The feeding & dosing quantity can be controlled by automatic, semi-auto, and manual method.

Custom Choices

Wafer Foup Cases, Wafer Feeding Machine, Deliver Robot, Tank Materials, Heaters, Dryers, Analysis System, Dosing Control

Thickness Precision Control

Accurately control the thickness (nanometer to micrometer level), uniformity, and composition of the film layer.

Thickness

3/ 0.3/ 0.03~0.05um

Fast Deposition Rate

Ni>180nm/min,Pd>30nm/min,Au>4nm/min

Wafer F Side

70~80%, Wafer B Side: 100%

Multi-Material Compatibility

Support coating various materials such as oxides, nitrides, metals, etc., to meet complex process requirements.

Metals

Ni/ Pd / Au/ Al/ Copper

One Stop Services for Wafer Electroless Plating Machine Purchase

With the following one stop services for your electroless plating machines order, you can achieve a hussle-free experience from maintanence to comsumable materials.

12 Months Waranty Service

Within warranty period, Replacing Parts are Provided for Free. After warranty period, parts for replacement can be provided at cost price. Lifetime services are offered.

Sample Delivery Service

Accept samples from customers to test electroplating craft by small batches. You can verify our machine performance by the samples. We cooperate with colleages, testing data can be provided.

OEM&ODM Service

We accept order industrial electroplating barrel machine with private labels. Zenith offer original craft design. Custom automatic wafer sorter machines are also available.

Consumables for Plating Machines

For Wafer

Etching Solution

For Advanced Packaging

Acid Solution

For Display Process

Alkali solution

Auxiliary Reagent

Chemical Pating Solution

Benchmarking Standard

Zenith photoresist, electroplating liquor and auxiliary reagent passed industry standard of benchmarking companies, which help offering you trustworthy one-stop services.

Electroplating Additive

Wafer Photoresist

Advanced Packaging Negative Photoresist

Photoresist Auxiliary Reagent

OLED/TFT-LCD Photoresist

FAQs

Does ZENITH offer components for replacement after waranty period?

Yes, the cooperation support will not end after waranty period. But the price of component for replacement should be at cost price, while in waranty period this price is free. In addition, if you offer a new order of equipment, the price could be communicated.

Does Zenith provide install and tuning services?

Yes. We provide on-site set up services. Install, commissioning, calibration and debugging services are offered by our engineers. You can send us your lead time demands and we offer you ideal solusions.

Does ZENITH have OEM&ODM services?

Yes, we could provide private label or white label services. Customization services are available according to your demands.

What analysis system is adapted by Zenith chemical plating equipment?

Our electroless plating equipment systems have XM-NIAS, Ancosys(Pd/Au) and Ancosys(Pretreatment) for analyzing.

What other wafer processing machines does Zenith provide?

Other than chemical plating machines, we also provide electroplating equipment, wet benches( Wafer cleaning machines, chemical distribution system, foup cleaning machines) in manual, semi-auto and automation types, spin rinse dryer, marangoni dryer and semiconductor chiller equipment and related comsumbles.

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